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MicrobondDocfish
Ultrafine Pitch Solder Paste for bumping applications
Around 50 bumps per chip, times 15 billion components per year, comes to 750 billion bumps per year – or 85 million bumps per hour… No matter how one looks at it, the quality required for every single bump is tremendous. It’s good to have a partner upon whom one can rely – bump after bump after bump… http://www.electronicmaterials.umicore.com/en/microbondEn/applications/docfish/MicrobondDocfish – don’t gamble with your wafer!
The trend towards smaller, faster and more integrated electronic devices has accelerated the need to move the functions of the microelectronic packages closer to the active die. The die is now required to be an integral part of the device. This trend is what drives “Wafer Bumping” technologies.
| Please click on the picture to download the MicrobondDocfish brochure in English. |
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Please click below to get to the website of the International Wafer-Level Packaging Conference which will be held in the Wyndham Hotel, San Jose, CA, from October 13-16, 2008:
