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MicrobondAntec
Materials for Die-Attach and Clip-Attach Applications
Die-Attach process completion remains the key step in power packages to ensure product reliability. The automotive and aerospace industry keeps setting high reliability standards. Thermal and mechanical fatigue of electronic components primarily comes from successive on/off switching activity. The main challenge in this crucial application is to find the optimum combination of material performance and available process windows. This is where Microbond material technology makes the difference. The Die-Attach joint has three main functions. In the first place it ensures mechanical fixing of the die onto the lead frame. Moreover, it enables heat dissipation from the die to the heat sink and eventually permits electrical contact.
Typical power devices involving the Die & Clip-Attach application are transistors, IGBTs or MOSFET. These packages are better known as: TO, SOT, SOD, SMA, SMB, SMC,
| Please click on the picture to download the MicrobondAntec brochure in English. | Please click on the picture to download the MicrobondAntec brochure in Chinese. |
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