Electronic Materials

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Umicore Worldwide

News

  • 12/03/2008

    International Wafer-Level Packaging Conference, San Jose, CA, from October 13-16, 2008

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  • 08/02/2008

    Umicore and ABB develop new process for material-saving production of HSM washers

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  • 12/10/2007

    Information about REACH

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Professional events!

  • IMAPS

    Please visit us at the IMAPS- 41st International Symposium on Microelectronics (International Microelectronics And Packaging Society), Rhode Island Convention Center - Providence, Rhode Island, USA from November 02 until November 06, 2008.

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Feature!

Microbond

Microbond offers a complete spectrum of products for electronic packaging and electroengineering applications. A sales staff and application engineering group with a worldwide radius of action, production locations in Germany and Singapore put us right up close to the major markets.

Today Umicore is known globally as one of the most innovative manufacturers of high-quality materials for semiconductor chip bonding. Our exceptional know-how in the manufacturing and processing of these
critical materials has given us a unique opportunity to become the undisputed leader in the development and application of specialized Die-Attach materials. The excellent quality of our products ensures
process-reliable and, consequently, more economical mounting of high-performance components. Frequent innovations drive our high standards and provide our customers with continuously improving quality.

The combination of our metals expertise, coupled with our strong chemical capabilities have made Microbond a world leader in the production of these Die-Attach materials. 

Decades of innovation and experience in materials for Die-Attach applications

From the start, we took three considerations to heart:

    • customer satisfaction
    • innovation
    • product quality

These maxims guide our daily work since customer satisfaction can only come from quality products.

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