
Please visit us at the International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Riverfront Business Hotel, in Pudong, Shanghai, China, from July 28 until July 31, 2008.
International Wafer-Level Packaging Conference, San Jose, CA, from October 13-16, 2008
Umicore and ABB develop new process for material-saving production of HSM washers
Information about REACH
Please visit us at the IMAPS- 41st International Symposium on Microelectronics (International Microelectronics And Packaging Society), Rhode Island Convention Center - Providence, Rhode Island, USA from November 02 until November 06, 2008.

Please visit us at the International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Riverfront Business Hotel, in Pudong, Shanghai, China, from July 28 until July 31, 2008.